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سؤال 335

What is a characteristic of DIP packaging used for integrated circuits?

  1. Extremely low stray capacitance (dielectrically isolated package)
  2. Extremely high resistance between pins (doubly insulated package)
  3. Two chips in each package (dual in package)
  4. Two rows of connecting pins on opposite sides of package (dual in-line package)پاسخ درست

توضیح

DIP stands for dual in-line package, and the name describes the physical form: two parallel rows of connecting pins along opposite sides of a rectangular body. It says nothing about dielectric isolation, pin-to-pin resistance, or how many chips are inside.

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شروع تمرین
سؤال 335: What is a characteristic of DIP packaging used for… · FCC Amateur Extra Class (Element 4) · Questena